C22-Diffusion bonding and characterization

No. Symposium Organiser Co-Organiser
C22  Diffusion bonding and characterization Prof. Robert Filipek
Faculty of Materials Science and Ceramics
AGH University of Science and Technology
al. Mickiewicza 30
30-059  Kraków. PL

rof@agh.edu.pl (rof null@null agh NULL.edu NULL.pl)

Prof. Natalia Sobczak
Head of the Center for High Temperature Studies
Foundry Research Institute
73 Zakopianska Street
30-418 Krakow

natalie@iod.krakow.pl (natalie null@null iod NULL.krakow NULL.pl) 

The problem to create joints among different multi-component and multi-phase materials: metallic alloys, ceramics, composites, FGM’s, glasses etc., having complex shapes and size is a critical point in many branches of modern industry, e.g., power, electronic, automotive, aviation, space, chemical industries and many others. The basic requirements are usually formulated with the reference to the joints in advanced materials  and they include the maximum mechanical strength of the joint, vacuum tightness, precision of the formed joint and the unit which this joint occurs. Depending on the specific applications of designed joints, they should also fulfil additional requirements like resistance to the thermal shocks, high temperature, higher rotations, wear, corrosion at the elevated temperatures etc. The choice of bonding technique determines the properties of obtained joints. In particular, diffusion bonding – a solid-state joining process – allows obtaining joints suitable for the ultra-high vacuum applications, with high service temperatures, compliant, strong and, in certain applications, reversible.The aim of this symposium is to discuss the fundamental issues related to:

  • Ecological and economical aspects of joining
  • Theoretical description of joining process and life time prediction
  • Optimisation of joining process – modelling
  • Inverse problems in diffusion bonding – determination of diffusion coefficients
  • Numerical methods and software, modelling tools
  • Mechanism of diffusion bonding – factors controlling kinetics of the process: diffusion, reactions, stresses, etc.
  • Characterization of physical properties of joints (mechanical strength, wear resistance, corrosion resistance, thermal conductivity, fatigue strength, etc.)
  • Technology of joining and applications